Temp&Humi Sensor(GXHTV3)
Heltec Quick Link Series GXHTV3 Temp&Humi Sensor stamp hole packaging (LGA) can be directly soldered onto the circuit
* With unified packaging, stamp hole packaging (LGA) that can be directly soldered onto the circuit.
* Compatible with Grove socket through the PH2.0 x 4 interface.
* Typical accuracy: ± 3 %RH and ± 0.2 ° C
Product introduction
What’s this?
The Temp&Humi Sensor, based on the GXHTV3 chip, is part of the Heltec Quick Link Series. The module features stamp hole packaging (LGA) for direct soldering onto the circuit or compatibility with the Grove socket through the PH2.0 x 4 interface.
Main Features
The Heltec QuickLink Series element offers a diverse range of sensors and actuators. With a standardized packaging size and interface, the stamp hole allows for direct soldering onto your board like most modules. Additionally, it can be optionally equipped with a PH2.0 x 4 interface to ensure compatibility with the Grove Socket. The GXHTC3 is a digital humidity and temperature sensor specifically designed for battery-powered high-volume consumer electronics applications. This sensor has been meticulously engineered to surpass traditional limitations in size, power consumption, and performance-to-price ratio in order to meet both current and future requirements.
Specification
- Tab1
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Parameters
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Description
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Supply Voltage
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3.3V
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Supply Current
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430μA
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Interfaces
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I2C on PH2.0 x 4
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I2C and SPI on LGA (2.54 stamp home)
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Operating Temperature Range
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-45~130℃
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Storage Temperature Range
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-45~130℃
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Dimension
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15*15*10mm(including QuickLink Socket)
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15*15*2mm(excluding QuickLink Socket)
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Picture display
Main Catagory
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