CO Gas Sensor
Heltec Quick Link Series CO Gas Sensor utilizes the GM-702B chip with stamp hole packaging (LGA) to achieve high sensitivity to carbon monoxide
* With unified packaging, stamp hole packaging (LGA) that can be directly soldered onto the circuit.
* Compatible with Grove socket through the PH2.0 x 4 interface.
* Strong structure and high sensitivity to carbon monoxide
* Compatible with Grove socket through the PH2.0 x 4 interface.
* Strong structure and high sensitivity to carbon monoxide
Product introduction
What’s this?
The CO Gas Sensor, utilizing the GM-702B chip, is part of the Heltec Quick Link Series. The module features stamp hole packaging (LGA) for direct circuit soldering or compatibility with the Grove socket via the PH2.0 x 4 interface.
Main Features
The Heltec QuickLink Series element offers a diverse range of sensors and actuators. With a standardized packaging size and interface, the stamp hole allows for direct soldering onto your board like most modules. Additionally, it can be optionally equipped with a PH2.0 x 4 interface to ensure compatibility with the Grove Socket. The MEMS carbon monoxide gas sensor utilizes the MEMS process to fabricate a micro-hot plate on a Si substrate, and employs a metal oxide semiconductor material with low conductivity in clean air as the gas sensitive material. Upon detection of gas in the ambient air, the sensor’s conductivity undergoes changes, with higher concentrations of gas resulting in increased sensor conductivity.
Specification
- Tab1
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Parameters
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Description
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Supply Voltage
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3.3V
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Interfaces
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I2C on PH2.0 x 4
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I2C and SPI on LGA (2.54 stamp home)
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Standard Test Condition
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Temperature: 20℃±2℃
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Humidity: 55%RH±5%RH
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Dimension
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15*15*10mm(including QuickLink Socket)
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15*15*2mm(excluding QuickLink Socket)
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Product Description
Picture display
Main Catagory
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