Atmospheric Pressure Sensor (BMP280)
Heltec Quick Link Series Atmospheric Pressure Sensor stamp hole packaging (LGA) that can be directly soldered onto the circuit.
* With unified packaging, stamp hole packaging (LGA) that can be directly soldered onto the circuit.
* Compatible with Grove socket through the PH2.0 x 4 interface.
* Measurement range of 300-1100 hPa, Accuracy: ± 1 hPa
Product introduction
What’s this?
The BMP280 chip-based Atmospheric Pressure Sensor is part of the Heltec Quick Link Series. The module features stamp hole packaging (LGA) for direct circuit soldering, or compatibility with the Grove socket via the PH2.0 x 4 interface.
Main Features
The Heltec QuickLink Series element offers a diverse range of sensors and actuators. With a standardized packaging size and interface, the stamp hole allows for direct soldering onto your board like most modules. Additionally, it can be optionally equipped with a PH2.0 x 4 interface to ensure compatibility with the Grove Socket. The BMP280 is a versatile atmospheric pressure sensor with a measurement range of 300-1100 hPa and an accuracy of ± 1 hPa. It finds widespread application in fields such as meteorology, geolocation, and altitude measurement.
Specification
- Tab1
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Parameters
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Description
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Supply Voltage
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3.3V
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Supply Current
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2.8μA
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Pressure Resolution
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0.16 Pa
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Temperature Resolution
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0.01°C
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Interfaces
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I2C on PH2.0 x 4
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I2C and SPI on LGA (2.54 stamp home)
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Measurement Modes
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P&T, forced or periodic
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Measurement Rate
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up to 157 Hz
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Filter Options
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Five bandwidths
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Storage Temperature
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-45~85℃
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Dimension
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15*15*10mm(including QuickLink Socket)
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15*15*2mm(excluding QuickLink Socket)
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Picture display
Main Catagory
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