3-Axis Acceleration(Dip Angle) Sensor
3-axis Acceleration(Dip Angle) Sensor(DA217) stamp hole packaging (LGA) that can be directly soldered onto the circuit
* With unified packaging, stamp hole packaging (LGA) that can be directly soldered onto the circuit.
* Compatible with Grove socket through the PH2.0 x 4 interface.
* RoHS compliant
* Compatible with Grove socket through the PH2.0 x 4 interface.
* RoHS compliant
Product introduction
What’s this?
The 3-axis Acceleration (Dip Angle) Sensor, based on the DA217 chip, is part of the Heltec Quick Link Series. The module features stamp hole packaging (LGA) for direct soldering onto the circuit or compatibility with the Grove socket through the PH2.0 x 4 interface.
Main Features
The Heltec QuickLink Series element offers a diverse range of sensors and actuators. With astandardized packaging size and interface, the stamp hole allows for direct soldering onto your board like most modules. Additionally, it can be optionally equipped with a PH2.0 x 4 interface to ensure compatibility with the Grove Socket. The DA217 sensor is an ultra-low power, high-performance capacitive three-axis linear accelerometer developed using micro-machined technology. The sensor element is fabricated from single crystal silicon using the DRIE process and is protected by a hermetically sealed silicon cap to ensure environmental protection.
Specification
- Tab1
|
Parameters
|
Description
|
|
Supply Voltage
|
2.5V
|
|
Typical Current
|
95μA
|
|
Storage Temperature Range
|
-45~125℃
|
|
Interfaces
|
I2C on PH2.0 x 4
|
|
I2C and SPI on LGA (2.54 stamp home)
|
|
|
Dimension
|
15mm*15mm*10mm(including Quick Link Socket)
|
|
15mm*15mm*2mm(excluding Quick Link Socket)
|
|
|
Operating Temperature Range
|
-40~85℃
|
Picture display
Main Catagory
Contact us to meet your needs.
Send Your Inquiry Today